Fiber Optics Bridge Card V2

can be used with DP 7000 digital processor

  • Samtec Firefly™ 170 Gbps Bi-directional Optical Engines (x12 14.1 Gbps)
  • Two Altera Arria™ 10 FPGAs (660/1150 GX) with up-to 3 TeraFlops of IEEE754-compliant floating-point DSP cores
  • Micron 2 GByte HMC with up-to 200 Gbps of Aggregate Memory Bandwidth (x16 12.5 Gbps)
  • 128 Gbps PCI-Express® x16 Gen3 connectivity (x16 8 GTps) with multi-channel DMA engine

Guzik Fiber Optics to PCIe® bridge / FPGA Accelerator Card V2, enables evolving markets such as High-speed Data-acquisition, High Performance Computing and Networking to take advantage of the latest Optics and Hybrid Memory Cube technology. The card provides 12 bi-directional optical links with total user data bandwidth greater than 20 GBps (160 Gbps) through the Samtec FireFly™ protocol-agnostic embedded optical engines. Powered by two Altera Arria 10 FPGAs (1150 GX) and backed by 2 GB Hybrid Memory Cube, it can be used as a development platform for general purpose applications requiring high speed FPGA to FPGA interconnects, processing, fast memory and x16 Gen3 PCIe® connectivity. The card is one PC slot wide and provides robust cooling, ideal for system integration.

Guzik Fiber Optics to PCIe® bridge / FPGA Accelerator Card V2 ships with tailored Intel/Altera’s best-in-class suite of IP cores, which deliver the highest performance, lowest latency, and smallest resource utilization in the FPGA industry. The best-in-class IP portfolio includes Ethernet, Interlaken, PCI Express, and Hybrid Memory Cube Controller IP Core (HMCC).

Leveraging Altera’s Stratix 10 or Arria® 10 devices, Hybrid Memory Cube delivers significant advantages over solutions using conventional DRAM technology which makes it an ideal solution for next generation high performance computing, military, and wireline communication applications.

Block Diagram:

bridge_v2_block_diagram_850x

 

Board top view:

ELECTRICAL/MECHANICAL SPECIFICATIONS

Form Factor: PCI-Express standard 1U GPU size

 

OPERATING ENVIRONMENT*

Temperature Range: 0° to 50°C (32° to 122°F)

Relative Humidity: 10 to 90% non-condensing

________________

*Designed to meet UL 60950, FCC Class B, CE safety and emissions